| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element mounting member, a semiconductor element mounted substrate and a semiconductor device, which inhibit occurrence of bleed-out caused by a silver paste used when a semiconductor element is mounted, are excellent in thermal conductivity and reliability, and capable of thinning to a higher degree. <P>SOLUTION: A semiconductor element mounting member 10 has a conductive metal layer pattern 13 and an insulation part 15 on a carrier substrate. The metal layer pattern is covered by the insulation part on a peripheral edge so as to have an exposed part in a portion of the metal layer pattern and a stepped part is formed between the insulation part and the exposed part. The metal layer pattern has a cross sectional shape such that an outermost peripheral part of the metal layer pattern protrudes from a part where the metal layer pattern and the carrier substrate are in contact with each other to the insulation part side when viewed from the side of the metal layer pattern of the member. A semiconductor element mounted substrate 20 and a semiconductor device 40 use the semiconductor element mounting member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
