THIN FILM FORMING METHOD AND THIN FILM FORMING APPARATUS

摘要

In the present invention, an operation of landing a droplet of a thin film material on an edge of a substrate surface region where a thin film pattern is to be formed, and an operation of hardening the thin film material thus landed are repeated, thereby forming an edge pattern composed of the thin film material at the edge of the region where the thin film pattern is to be formed. A droplet of the thin film material is landed on an inner region having the edge thereof demarcated by the edge pattern. The thin film material landed on the inner region is hardened. The thin film pattern composed of the edge pattern and the thin film material landed on the inner region is formed.