| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bamboo particle board which has a low water absorption rate and a small thickness expansion rate caused by water absorption (good dimension stability), prevents reduction in bending strength even in absorbing water and has excellent peeling resistance. <P>SOLUTION: The bamboo particle board is formed by adding an isocyanate-based adhesive to bamboo chips and hot-pressing molding the bamboo chips, and has density of 0.73-0.95 g/cm<SP POS="POST">3.</SP>The bamboo chips include: 0-10 wt.% of bamboo chips which pass through a sieve having an aperture of 4.75 mm and do not pass through a sieve having an aperture of 2.8 mm; 75-95 wt.% of bamboo chips which pass through the sieve having an aperture of 2.8 mm and do not pass through a sieve having an aperture of 0.35 mm of; and 1-25 wt.% of bamboo chips which pass through the sieve having an aperture of 0.35 mm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
