| 摘要 |
The invention provides a carrier plate (11) with test surfaces (22, 33, 26) for assessing a selective soldering process. A method for the use of such a carrier plate is also protected. According to the invention, the carrier plate has various zones that are provided with peripheral boundaries (22). The zones (23, 33) are not wettable with solder, while the peripheral boundaries (22) are wettable. If a selective solder head is advanced to the reference areas (33), the respective peripheral boundary must, provided there is no quality defect, be just wetted with solder, thus enabling an assessment to be made of the selective soldering process. The test plate offers the advantage of a simple optical assessment, for example by visual inspection. |
