| 摘要 |
A thermocompensation element (14) with at least one expansion element (17) which is encapsulated between a first ring profile (15) and a second ring profile (16), wherein the material of the expansion element (17) has at least a coefficient of thermal expansion which is greater than the coefficient of thermal expansion of the material from which at least one of the ring profiles (15, 16) is made, and wherein the ring profiles (15, 16), which are displaceable axially in relation to each other and are guided radially on each other, are plugged together axially along a common centre axis (11) in such a manner that axially aligned ring walls (20, 21) of the first ring profile (15) at least partially engage between axially aligned ring walls (22, 23) of the second ring profile (16) and, in the process, the expansion element (17) is at least partially enclosed circumferentially at a first section (18) by the ring walls (20, 21) of the first ring profile (15).
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