发明名称 |
MOUNTED STRUCTURE AND MOTOR |
摘要 |
<p>A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn-Ag-Bi-In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from -40 to 150°C has been suppressed.</p> |
申请公布号 |
EP2395823(A4) |
申请公布日期 |
2013.01.23 |
申请号 |
EP20100721264 |
申请日期 |
2010.02.22 |
申请人 |
PANASONIC CORPORATION |
发明人 |
KONDO, KENJI;HIDAKA, MASAHITO;KUYAMA, KOJI;KAMOGI, YUTAKA |
分类号 |
H05K3/34;B23K35/26;C22C13/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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