| 摘要 |
<p>PURPOSE: A composition for removing photoresist is provided to have excellent corrosion resistance for a copper wire, low adsorption amount, and sufficient cleaning performance. CONSTITUTION: A composition for removing photoresist comprises a compound indicated in chemical formula 1. In chemical formula 1, R1 is a hydrogen atom, C1-10 linear or branched alkyl group, carboxyl group, an amino group, a hydroxy group, a cyano group, a formyl group, a sulfonyl alkyl group, or a sulfonyl group, R2 is C1-6 linear or branched alkylene group, and R3 and R4 is independently a hydroxyl group, or a C1-6 linear or branched hydroxyl alkyl group.</p> |
