发明名称 ANISOTROPIC CONDUCTIVE FILM AND CIRCUIT BOARD USING THE SAME
摘要 <p>Provided are an anisotropic conductive film, which has a good insulation property in narrow space and improves connection reliability at a fine connection pitch, and a circuit board using the same. The anisotropic conductive film is interposed between circuit electrodes facing each other, applies pressure to the facing circuit electrodes, and connects pressure-directional electrodes to each other electrically. The anisotropic conductive film is a laminate consisting of a first adhesive film layer and a second adhesive film layer. The first adhesive film layer contains a polymer of photo-polymerizable resin composed of any one selected from acrylate, methacrylate, or maleimide, an epoxy resin, a hardener for epoxy resins, and conductive particles. The second adhesive film layer contains an epoxy resin and a hardener for epoxy resins.</p>
申请公布号 KR20070028501(A) 申请公布日期 2007.03.12
申请号 KR20070016296 申请日期 2007.02.16
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 MATSUDA KAZUYA;WATANABE ITSUO;GOTOU YASUSHI;NAKAZAWA TAKASHI
分类号 H01B1/00 主分类号 H01B1/00
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