CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A method for manufacturing printed circuit boards using a carrier for manufacturing a substrate is provided to easily manufacture two coreless substrates by using a carrier for manufacturing a substrate with a method of wrapping the outer sides of the carrier and seed layer. CONSTITUTION: A carrier layer(110) is formed in two stages. Seed layers(120) are respectively laminated on the exposed sides of each carrier layer. An insulating layer(130) wraps the outer sides of the carrier layer and seed layer. Metal layers(140) are spread on both surfaces of the insulating layer.