发明名称 |
Method of producing multilayer printed wiring board and photosensitive dry film used therefor |
摘要 |
A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface. A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.
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申请公布号 |
US8356404(B2) |
申请公布日期 |
2013.01.22 |
申请号 |
US20060580157 |
申请日期 |
2006.10.13 |
申请人 |
IBIDEN CO., LTD.;TSUDA AKIYOSHI |
发明人 |
TSUDA AKIYOSHI |
分类号 |
B32B37/00 |
主分类号 |
B32B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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