| 摘要 |
PURPOSE: A semiconductor device manufacturing method which utilizes heat-resistant adhesive sheet is provided to reduce the number of defective products created due to an adhesive sheet in a loading process by attaching a heat-resistant adhesive sheet after the loading process. CONSTITUTION: A metal lead frame is prepared. A semiconductor chip is loaded on the metal lead frame. A lead of the metal lead frame and the semiconductor chip are connected through a wire. The metal lead frame is attached to a heat-resistant adhesive sheet(1). The semiconductor chip is sealed using a sealing resin. The heat-resistant adhesive sheet is removed after sealing the semiconductor chip. |
