| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a liquid supply method, a liquid supply device, a substrate polisher, and a liquid supply flow measuring method, which prevent granular material such as slurry contained in liquid from adhering to a pipe to be clogged, from applying stress to the supplied liquid, and from causing a change in property of the liquid. <P>SOLUTION: This liquid supply device for supplying a predetermined flow of polishing liquid from a polishing liquid supply source 103 to the polishing surface of a polishing table 104, includes: supply tubes T1, T2, T3 disposed vertically for storing liquid from the polishing liquid supply source 103; and electropneumatic regulators REG1 to REG3 for supplying pressure gas from a gas source to the supply tubes T1, T2, T3, wherein the polishing liquid filling the supply tubes T1, T2, T3 is supplied to the polishing surface of the polishing table 104 through pipes L2-1, L2-2, L2-3 and a polishing liquid supply pipe L5 without a throttle part for controlling the flow by supplying the pressure gas to the supply tubes T1, T2, T3. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
