| 摘要 |
PURPOSE: A substrate plating apparatus is provided to improve the plating uniformity of a substrate by transmitting electrolyte with metal ions of high density to the inner region of a substrate with smaller current density than the outer region of the substrate. CONSTITUTION: A process chamber(110) receives electrolytes(103). A process chamber includes an inner chamber(111) and an outer chamber(115). A target unit(120) generates plus metal ions. A voltage applying unit(140) supplies a voltage to the substrate and the target unit. An electrolyte diffuser(150) controls the flow of the electrolyte which moves the plus metal ions.
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