RESIN SEAL MOLDING METHOD OF ELECTRONIC COMPONENT AND APPARATUS THEREFOR

摘要

PURPOSE: A method and apparatus for sealing the resin of an electric part are provided to prevent a resin package from being separated from a compression frame by fixing the periphery of the resin package. CONSTITUTION: A molding unit(2a) formed on the opening periphery of a resin molding cavity(4) fixes the periphery of a resin package. A compression frame(3) is separated from the body of the resin package. The molding unit of the opening periphery of the cavity is separated from the peripheral part of the resin package. The vacuum state of the cavity is released by connecting air lines.