| 摘要 |
PURPOSE: An LED package trimming device is provided to reduce the failure rate of an LED package by individualizing substrates using a trimming unit. CONSTITUTION: A guide block(200) is fixed to a base frame(100). A first transfer module transfers a frame in a first direction using the guide block. A second transfer module transfers the first transfer module in a second direction which is vertical to the first direction. An image processing module(500) generates substrate information by photographing the substrates. A trimming module(600) is arranged on the upper side of the guide block. [Reference numerals] (AA) First direction; (BB) Second direction
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