FLEXIBLE PRINTED CIRCUIT, METHOD FOR MANUFACTURING SAME, FLEXURE AND ELECTRONIC DEVICE
摘要
<p>A cover insulating layer (4) covers the edge portion of each terminal (3) in an interconnection pad (K) and a wiring pattern (11) on the base side of the terminal together with a base insulating layer (2) therearound. The terminal is exposed only at an opening (7) which is opened at a position where the cover insulating layer faces the terminal and the bottom surface (7b) of the opening is comprised of only the upper surface (3a) of the terminal. The end face of the cover insulating layer (4) and the end face of the base insulating layer (2) are flush with each other so as to form an end face (E) of the interconnection pad.</p>
申请公布号
WO2013008567(A1)
申请公布日期
2013.01.17
申请号
WO2012JP64865
申请日期
2012.06.11
申请人
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.;PARK, JINJOO;UEDA, HIROSHI;KAKIMOTO, MASAYA