发明名称 TWO-LAYER PRINTED CIRCUIT BOARD, PRINTING METHOD THEREOF, AND MOBILE COMMUNICATION TERMINAL
摘要 <p>A two-layer printed circuit board, a printing method thereof, and a mobile communication terminal overcome the disadvantage of the high cost of a six-layer printed circuit board or a four-layer printed circuit board used by the existing low-end mobile communication terminal. The two-layer printed circuit board is based on the MT6251 platform. The diameter of a bonding pad is 0.27 millimeters. The line width of a wiring between two bonding pads is 0.075 millimeters. A minimum interval between the wiring and the bonding pad is 0.075 millimeters. A wire from a bonding pad in an inner row is threaded through a place between bonding pads in an outer row. The back of a main ground bonding pad of a main chip is a whole ground plane. A ground hole is opened after a C7 pin and a C8 pin are led outward. When the two-layer printed circuit board of the embodiment of the present invention is applied to the mobile communication terminal, compared with a mobile communication terminal using a four-layer printed circuit board or a six-layer printed circuit board, the cost is obviously reduced in the premise of no loss of functions and the competitive advantage of the product is improved.</p>
申请公布号 WO2013007083(A1) 申请公布日期 2013.01.17
申请号 WO2011CN83665 申请日期 2011.12.08
申请人 ZTE CORPORATION;LIU, YUPENG 发明人 LIU, YUPENG
分类号 H05K1/00;H04W88/02;H05K3/46 主分类号 H05K1/00
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