发明名称 Laser Processing Method
摘要 A laser process apparatus is provided to fuse an adhesive film mounted on a semiconductor chip without damaging the same by using a process line map generated based on image data. A process region detector(6) photographs a plurality of process regions by a predetermined interval along a process conveying direction when a target is moved to the process conveying direction to generate image data. The generated image data is sent to a controller(8). The controller calculates coordinates with respect to a multiplicity of process positions to be processed based on the image data generated by the process region detector. The controller makes a process line map which links the coordinates and then controls a process conveyer(37) and separated conveyers(38,43).
申请公布号 KR101223203(B1) 申请公布日期 2013.01.17
申请号 KR20060058114 申请日期 2006.06.27
申请人 发明人
分类号 H01L21/78;H01L21/82 主分类号 H01L21/78
代理机构 代理人
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