| 摘要 |
PROBLEM TO BE SOLVED: To suppress the spread of chipping caused by the mechanical damage of a blade at the time of dicing to a minimum without reducing throughput in a semiconductor device. SOLUTION: For example, a scribe line 14 is provided between semiconductor chips 12 formed on a wafer 10. A mark region 16 and a blade region 18 are provided on the scribe line 14. Further, an annular chipping prevention wall 20 is arranged on the scribe line 14 so that the periphery of each chip 12 is surrounded. The chipping prevention wall 20 has the same wiring structure as the inner wiring of the chip 12. The chipping prevention wall is arranged close to the blade region 18 in consideration of processing variation. COPYRIGHT: (C)2008,JPO&INPIT |
