RESIN COMPOSITION, FILM, LAMINATE, CURED PRODUCT, AND COMPOSITE

摘要

PROBLEM TO BE SOLVED: To provide a film excellent in a wiring embedding property, and excellently formable of a conductor layer by electroless plating while keeping a surface roughness small, and to provide a resin composition giving a cured product.

SOLUTION: The resin composition contains a thermosetting resin (A), a spherical surface-treated silica (B) having an average particle diameter of 5 μm or smaller and preliminarily surface-treated by a surface-treating agent X that has a functional group that can react with the thermosetting resin (A), and a spherical untreated silica (C) having an average particle diameter smaller than the surface-treated silica (B) and not surface-treated by the surface-treating agent X.

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