| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a fine processing pattern with high position precision without using a photomask, typically, a method relating to a contact opening in the process for manufacturing a semiconductor device. SOLUTION: A thin film is formed on a substrate, an interlayer insulating film is formed on the thin film, a micro-lens is formed by making a liquid material to become a lens material reach the region overlapping with the location wherein the opening is formed in the interlayer insulating film and the thin film by a liquid drop discharging method, and the micro-lens is irradiated with laser light to converge the light on the thin film so that parts of the thin film and the interlayer insulating film are removed to form the opening. COPYRIGHT: (C)2008,JPO&INPIT
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