| 摘要 |
A manufacturing method for an EMI-preventing socket comprises the following steps of: providing an EMI-preventing element and a plurality of pins that include a ground pin; connecting a connecting portion of the EMI-preventing element to the ground pin; providing a mold; placing the EMI-preventing element, the ground pin and the other pins in the mold in such a manner that the EMI-preventing element surrounds the pins; and providing a molding material into the mold to wrap the pins, and a joint of the connection portion of the EMI-preventing element and the ground pin to form a socket body of the EMI-preventing socket. Parts of the EMI-preventing element and one ends of the pins are exposed out of the socket body of the EMI-preventing socket. An EMI-preventing socket made by the manufacturing method is also disclosed.
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