发明名称 |
LAMINATED BOARD, METAL-FOILED LAMINATED BOARD, PRINTED WIRING BOARD AND CIRCUIT BASE BOARD, LED BACKLIGHT UNIT, LED LIGHTING DEVICE AND MANUFACTURING METHOD OF LAMINATED BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated board which does not impair a heat resistance property and drill processability and is high in heat dissipation performance. <P>SOLUTION: The laminated board contains 80 to 150 pts.vol. of an inorganic filler with respect to 100 pts.vol. of a thermosetting resin. The inorganic filler contains gibbsite-type aluminum hydroxide particles (A) and a particle component (B). The gibbsite-type aluminum hydroxide particles (A) have 2 to 15 μm of average particle diameters (D<SB POS="POST">50</SB>). The particle component (B) is composed of aluminum oxide particles having 1.5 μm or smaller of average particle diameters (D<SB POS="POST">50</SB>). In the density distribution of the particle component (B), the distribution not smaller than 5 μm in particle diameter is not larger than 5 mass%, the distribution not smaller than 1 μm to smaller than 5 μm in particle diameter is not larger than 40 mass%, and the distribution smaller than 1 μm in particle diameter is not smaller than 55 mass%. The particle component (B) contains not smaller than 30 mass% of crushed aluminum oxide particles. A compound ratio (volume ratio) between the gibbsite-type aluminum hydroxide particles (A) and the particle component (B) is 1:0.2 to 0.5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013010344(A) |
申请公布日期 |
2013.01.17 |
申请号 |
JP20120108668 |
申请日期 |
2012.05.10 |
申请人 |
PANASONIC CORP |
发明人 |
SHIMIZU HIROMI;SUZUE TAKAYUKI;NOZUE AKIYOSHI;NAKAGAWA TERUO |
分类号 |
B32B5/28;B32B15/08;C08K3/22;C08L63/00;H05K1/03 |
主分类号 |
B32B5/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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