| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including an element mounting part for sharing on a die pad of a lead frame, in which semiconductor elements of various kinds, multifunction performances and various sizes can be mounted on the element mounting part. <P>SOLUTION: A semiconductor device of the present invention comprises a support medium for mounting a semiconductor element. The support medium includes L-shaped groove parts and non-wet parts. The L-shaped groove parts are formed in a multiple layered manner. The support medium is formed by a lead frame. The support medium is formed by a substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
