SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and the like which make particles less likely to adhere to a substrate when performing a process where a substrate is placed in contact with a high pressure fluid to remove a liquid adhered to the substrate.

SOLUTION: A substrate processing method includes the steps of: opening a blocking part provided at a fluid supply path 351 when a high pressure fluid is supplied to the interior of a process container 31 where a process for removing a liquid for preventing dryness on a surface of a substrate W is performed, and opening an on-off valve 352 with the flow rate adjusted by a flow rate adjustment part 354 to introduce the high pressure fluid to the process container 31 (or changing a material fluid into the high pressure fluid in the process container 31) and remove the liquid for the dry prevention from the surface of the substrate W; opening the on-off valve 352 and a pressure reducing valve 342 while putting the blocking part into the blocking state and depressurizing the fluid supply path 351 and the process container 31 through an exhaust path 341 connecting with the process container 31; and then transferring the substrate W from the process container 31. Control signals are output to perform these steps.

COPYRIGHT: (C)2013,JPO&INPIT