发明名称 Resin Foam and Foam Sealing Material
摘要 <p>There is provided a resin foam excellent in dustproofness and assemblability. The resin foam has a repulsive stress at 80% compression (repulsive stress when a resin foam is compressed by 80% of the initial thickness) of 1.0 to 9.0 N/cm 2 and a tensile modulus of elasticity of 5.0 to 14.0 MPa. Preferably, the resin foam further has an average cell diameter of 10 to 180 µm and an apparent density of 0.01 to 0.10 g/cm 3 .</p>
申请公布号 EP2546292(A2) 申请公布日期 2013.01.16
申请号 EP20120175904 申请日期 2012.07.11
申请人 NITTO DENKO CORPORATION 发明人 KATO, KAZUMICHI;SAITOU, MAKOTO;HATANAKA, ITSUHIRO;KODAMA, KIYOAKI
分类号 C08J9/12;C09J7/02 主分类号 C08J9/12
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