发明名称 WAVE SOLDERING TANK
摘要 A WAVE SOLDERING TANK INCLUDES A SOLDERING TANK BODY FOR HOUSING MOLTEN SOLDER AND A SOLDER FEED CHAMBER DISPOSED WITHIN THE SOLDERING TANK BODY. AN AXIAL-FLOW, MULTIPLE-BALDE SCREW-TYPE PUMP IS DISPOSED SO AS TO DRAW MOLTEN SOLDER INTO THE SOLDER FEED CHAMBER THROUGH AN INLET AND DISCHARGE THE MOLTEN SOLDER THROUGH AN OUTLET. IN A PREFERRED EMBODIMENT, THE PUMP INCLUDES A ROTATABLE HUB AND A PLURALITY OF HELICAL BLADES SECURED TO THE HUB AT EQUAL INTERVALS IN THE CIRCUMFERENTIAL DIRECTION OF THE HUB, EACH OF THE BLADES OVERLAPPING AN ADJOINING ONE OF THE BLADES WHEN THE BLADES ARE VIEWED IN THE AXIAL DIRECTION OF THE IMPELLER.
申请公布号 MY137398(A) 申请公布日期 2009.01.30
申请号 MYPI20044166 申请日期 2004.10.11
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 AKIRA TAKAGUCHI;ISSAKU SATO;NOBORU HASHIMOTO;JUNICHI OKAMURA
分类号 B23K3/06 主分类号 B23K3/06
代理机构 代理人
主权项
地址
您可能感兴趣的专利