| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate for an electronic component inspection fixture which is adaptive to microfabrication of electrode terminals of an electronic component and upsizing of an electronic component assembly and has high size precision and high strength. SOLUTION: Disclosed is the manufacturing method of the multilayer ceramic substrate 100 for the electronic component inspection fixture including: a process (a) of forming a via hole 13 in a substrate 12 having been baked after fabricating the first baked substrate 12 by baking a first ceramic green sheet 11 at the first temperature, and then charging conductive paste 14 which can be baked at the second temperature lower than the first temperature in the via hole 13; a process (b) of obtaining a composite laminate by laminating the first baked substrate 12 having the conductive paste charged on one main surface of a stack of second ceramic green sheets 16A to 16D which can be baked at the second temperature; a process (c) of baking the composite laminate at the second temperature; and a process (d) of forming electrodes 21 on a non-stack side surface of the baked substrate 12 of the baked composite laminate. COPYRIGHT: (C)2009,JPO&INPIT |
