SUBSTRATE-PLACING MECHANISM, APPARATUS FOR PROCESSING SUBSTRATE, METHOD FOR SUPPRESSING FILM DEPOSITION ON SUBSTRATE PLACING MECHANISM, AND STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a substrate-placing mechanism capable of suppressing film deposition.

SOLUTION: The substrate-placing mechanism includes: a heater plate 21 which has a surface 21a on which a substrate W to be processed is placed and has a heating body 21b embedded therein for heating the substrate W to a film deposition temperature at which a film is deposited; and a temperature adjustment jacket 22 which is formed to cover at least a surface of the heater plate 21 other than the surface 21a thereof and which adjusts the temperature to be below the film deposition temperature.

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