| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip for reducing costs and improving shock resistance, and improving cosmetic design, to provide a commodity, or the like in which the chip is mounted, and to provide a method for manufacturing them. <P>SOLUTION: The chip having an integrated circuit with a semiconductor film with a thickness of 0.2 μm or smaller is mounted to a container, or the like of security documents including banknotes, one's possessions, drinks, and the like. The chip has lower costs, and higher shock resistance than a chip manufactured by a silicon wafer, and further does not damage cosmetic design. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
