| 摘要 |
Provided are a method, an apparatus and a program for filling a liquid material, which do not require complicated parameter calculation and do not affect the moving speed of a discharge section. In the method, a gap between a substrate and a work placed thereon is filled with the liquid material discharged from the discharge section by using capillary phenomenon. The method is characterized in forming an application pattern composed of an application region and a non-application region along the outer circumference of a work and correcting a liquid material discharge quantity by expanding/contracting a liquid material discharge quantity by expanding/contracting the application region and the non-application region. The apparatus and the program for performing such method are also provided. |
