| 发明名称 |
Aerosol deposition process |
| 摘要 |
A circuit substrate includes a passive element and an interconnection pattern, wherein any of the passive element and the interconnection pattern is formed by an aerosol deposition process that uses aerosol of a fine particle material.
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| 申请公布号 |
US7579251(B2) |
申请公布日期 |
2009.08.25 |
| 申请号 |
US20040820114 |
申请日期 |
2004.04.08 |
| 申请人 |
FUJITSU LIMITED;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY |
发明人 |
IMANAKA YOSHIHIKO;AKEDO JUN;LEBEDEV MAXIM |
| 分类号 |
H01L21/8222;H01L21/48;H01L23/498;H01L27/08;H05K1/16;H05K3/46 |
主分类号 |
H01L21/8222 |
| 代理机构 |
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