| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetic film plating apparatus which employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. SOLUTION: The magnetic film plating apparatus includes: a plating tank 40 for holding a plating solution Q therein; an anode 220 vertically disposed in the plating tank 40 at a position to be immersed in the plating solution Q; a substrate holder 26 for holding a substrate W and positioning the substrate W opposite the anode 220; and a magnetic field generator 114, disposed outside the plating tank Q, for generating a magnetic field around the substrate W held by the substrate holder 26 and positioned opposite the anode 220. COPYRIGHT: (C)2010,JPO&INPIT |
