| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method capable of joining by laser beams without needing any mask for covering a microchannel. <P>SOLUTION: The face on the side at which a microchannel 11A is formed in a resin substrate 11 at which the microchannel 11A is formed on the surface side and the flat face of a resin substrate 12 are contacted, so as to be the face 112 to be joined. laser beams LA is condensed on the face 112 to be joined via the resin substrate 12, so as to be the shape of a line with a length satisfying a joining width SH or above at an optical strength almost uniform to the longitudinal direction, the face 112 to be joined is scanned by a line-shaped light condensing part LP to a direction crossed to the longitudinal direction of the light condensing part LP, the surfaces of the resin substrates 11, 12 are joined each other in the face 112 to be joined by light fusion by the light energy of the laser beams LA, and, in such a manner that the energy of the laser beams LA condensed so as to be a line shape is dispersed to a degree at which heat stress is not generated at the inside of the microchannel 11A, the line-shaped light condensing mode of the laser beams LA is set. <P>COPYRIGHT: (C)2010,JPO&INPIT |
