发明名称 |
Photosensitive resin composition and dry film comprising the same |
摘要 |
The present invention relates to a photosensitive resin composition which is developable with an alkaline aqueous solution and does not need a high temperature for curing and the like, and has all the properties suitable for use in a cover film of a printed circuit board or a laminated body for a semiconductor, and a dry film comprising the same. The photosensitive resin composition comprises (A) a polyamic acid comprising a polymer of at least one diamine compound and at least one acid dianhydride; (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated bond in its molecule; and (C) a photoinitiator.
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申请公布号 |
US8354219(B2) |
申请公布日期 |
2013.01.15 |
申请号 |
US201113191027 |
申请日期 |
2011.07.26 |
申请人 |
LG CHEM, LTD.;KIM HEE-JUNG;KYUNG YOU-JIN;LEE KWANG-JOO |
发明人 |
KIM HEE-JUNG;KYUNG YOU-JIN;LEE KWANG-JOO |
分类号 |
G03F7/038 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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