METHOD FOR MANUFACTURING SPUTTERING TARGET AND SPUTTERING TARGET BY THE METHOD
摘要
PURPOSE: A method for manufacturing a sputtering target and a sputtering target by the method are provided to control the height of a spacer and to prevent the warpage of a target. CONSTITUTION: A bonding material is arranged in the upper surface of a backing plate(S1). A sinter material is loaded in the upper surface of the bonding material(S2). The bonding material is fused(S3). The fused bonding material is cooled to bond the backing plate and the sinter material(S4). [Reference numerals] (AA) Start; (BB) End; (S1) Step of preparing bonding; (S2) Step of loading a sinter material; (S3) Step of melting a bonding material; (S4) Step of bonding
申请公布号
KR20130004715(A)
申请公布日期
2013.01.14
申请号
KR20110065937
申请日期
2011.07.04
申请人
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
发明人
KIM, CHUL EI;YOON, HAN HO;PARK, JU OK;CHOO, KYOUNG MUN