SUPERCONDUCTING ELEMENT, MANUFACTURING METHOD OF SUPERCONDUCTING ELEMENT, AND SUPERCONDUCTING CURRENT LIMITING DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress the diffusion of components (In, Bi, Sn, Pb) contained in solder to a superconducting layer.

SOLUTION: A superconductive element includes: a substrate 32; an intermediate layer 34 formed on the substrate 32; a superconducting layer 36 formed on the intermediate layer 34; a metal microparticle sintered layer 40 formed on at least a part of the superconducting layer 36 by sintering metal microparticles; and an electrode 44 joined on the metal microparticle sintered layer 40 with solder 42 including at least one component selected from In, Bi, Sn, and Pb.

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