| 摘要 |
<P>PROBLEM TO BE SOLVED: To substantially reduce an occupied area of wiring. <P>SOLUTION: A semiconductor device comprises: a plurality of first connection regions arranged on a semiconductor substrate in a first direction and a second direction crossing the first direction; and a plurality of wirings electrically connecting the plurality of first connection regions by row in the first direction. The plurality of wirings are arranged such that two neighboring wirings in the second direction are arranged in different wiring layers and curved so as to be seen as a honeycomb-shape where the two wirings partially overlap with each other, in plan view. <P>COPYRIGHT: (C)2013,JPO&INPIT |
