POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To suppress reduction in productivity and to reduce wiring inductance.

SOLUTION: A power semiconductor module has: a first package having an upper arm circuit part; a second package having a lower arm circuit part; a metal case forming a housing space for housing the first and second packages, and an opening connected with the housing space; and an intermediate connection conductor connecting the upper arm circuit part and the lower arm circuit part with each other. The case includes a first heat dissipation part, and a second heat dissipation part opposed to the first heat dissipation part via the housing space. The first package is arranged so that arrangement directions of the first and second packages are parallel to each opposed surface of the first and second heat dissipation parts. The intermediate connection conductor connects an emitter side terminal extending from the first package and a collector side terminal extending from the second package in the housing space of the case.

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