发明名称 HIGH ASPECT RATIO OPENINGS
摘要 A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at % carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20:1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening.
申请公布号 US2013008000(A1) 申请公布日期 2013.01.10
申请号 US201213616642 申请日期 2012.09.14
申请人 MICRON TECHNOLOGY, INC.;KIEHLBAUCH MARK W. 发明人 KIEHLBAUCH MARK W.
分类号 H01G13/00 主分类号 H01G13/00
代理机构 代理人
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