ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

摘要

To provide: an electronic component which is capable of suppressing mounting failure when mounted on a circuit board; and a method for producing the electronic component. A laminate (12) has a mounting surface (S1), and an end face (S3) that is adjacent to the mounting surface (S1). An external electrode (14a) is provided over the end face (S3) and the mounting surface (S1), and comprises a base electrode (32a) and a plating electrode (34a) that is provided on the base electrode (32a). An external electrode (14c) is provided on the mounting surface (S1), and comprises a base electrode (32c) and a plating electrode (34c) that is provided on the base electrode (32c). The area of the base electrode (32c) is smaller than the area of the base electrode (32a), and the thickness (T2) of the base electrode (32c) is larger than the thickness (T1) of the base electrode (32a) on the mounting surface.