发明名称 DRAM DEVICES AND METHODS OF MANUFACTURING THE SAME
摘要 A DRAM device includes a substrate including an active region having an island shape and a buried gate pattern. A mask pattern is over an upper surface portion of the substrate between portions of the buried gate pattern. A capping insulating layer fills a gap between portions of the mask pattern. A first pad contact penetrates the capping insulating layer and the mask pattern, and contacts a first portion of the substrate in the active region. Second pad contacts are under the capping insulating layer, and contact a second portion of the substrate in the active region positioned at both sides of the first pad contact. A spacer is between the first and second pad contacts to insulate the first and second pad contacts. A bit line configured to electrically connect with the first pad contact, and a capacitor configured to electrically connect with the second pad contacts, are provided.
申请公布号 US2013009226(A1) 申请公布日期 2013.01.10
申请号 US201213540816 申请日期 2012.07.03
申请人 SAMSUNG ELECTRONICS CO., LTD.;PARK JONG-CHUL;KANG BYUNG-JIN;JEONG SANG-SUP 发明人 PARK JONG-CHUL;KANG BYUNG-JIN;JEONG SANG-SUP
分类号 H01L21/8242;H01L27/108 主分类号 H01L21/8242
代理机构 代理人
主权项
地址