SILVER POWDER FOR SINTERED CONDUCTIVE PASTE

摘要

PURPOSE: A silver powder for a sintered conductive paste is provided to maintain BET and carbon content within a specific range, thereby improving adhesion between a silicon substrate and a silver film. CONSTITUTION: A silver powder for a sintered conductive paste has a particle diameter of 1.10-2.60 micron which is calculated from a specific surface area measured by using a BET method, a carbon content of 0.11-0.22 weight%, a D50 ratio(D50/BET) of 3.00 or less by a particle distribution based on volume which is obtained by laser diffraction scattering particle distribution measurement method, heat shrinkage at 500°C of 8.7-13.0 %, and a specific surface area of 0.60 m^2/g or less. A sintered conductive paste is formed by using the silver powder.