| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a surface treatment agent achieving favorable solderability by forming a chemical conversion coating excellent in heat resistance and wettability with solder on a surface of copper or a copper alloy constituting a circuit part or the like of a printed wiring board when electronic components or the like are bonded to the printed wiring board using solder; a surface treatment method; a printed wiring board; and a soldering method. <P>SOLUTION: A surface treatment agent for copper or a copper alloy includes a specified imidazole compound, wherein the compound has a structure where a phenyl group, a thienyl group or a benzyl group in which a hydrogen atom of a benzene ring may be replaced with a chlorine atom is bonded to the 2-position of an imidazole ring, a thienyl group is bonded to the 4 (5)-position of the imidazole ring, and a hydrogen atom or a methyl group is bonded to the 5 (4)-position of the imidazole ring. <P>COPYRIGHT: (C)2013,JPO&INPIT |
