| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small and reliable sensor device and a manufacturing method of the same. <P>SOLUTION: The sensor device 1 comprises: an IC chip 10 as a semiconductor device having a first electrode 11 on a first face 10a; and a vibration gyro element 20 serving as a vibration piece which has a base 21, a vibration unit extending from the base 21, and an extraction electrode 29 as a second electrode on a second face 20a facing the first face 10a. A cylindrical support 32 which is made of an insulating resin and has an opening 32a for exposing at least a part of a third electrode 37 electrically connected to the first electrode 11 via wiring 36 is arranged on the first face 10a. A conductive adhesive 98 is buried in a recess formed of the first face 10a and the opening 32a, and a bump 12 provided to the extraction electrode 29 is disposed in the recess. <P>COPYRIGHT: (C)2013,JPO&INPIT |
