| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing a semiconductor element in a semiconductor module from being damaged. <P>SOLUTION: A semiconductor device 1 includes: two semiconductor modules 4; and a first and second coolers 2 and 3 that cool the semiconductor modules 4, with the semiconductor modules 4 provided between both coolers. Each semiconductor module 4 includes: a semiconductor element 41; a first and second conductive plates 44 and 45 connected to the semiconductor element 41, with the semiconductor element 41 provided between both conductive plates; and a mold unit 46 that encapsulates the semiconductor element 41 and the first and second conductive plates 44 and 45. The mold unit 46 has a projection 461 that relatively projects toward the second cooler 3 as compared with a second exposed surface 452 of the second conductive plate 45. A first exposed surface 442 of the first conductive plate 44 is pressed by the first cooler 2, and the projection 461 is plastically deformed with pressed by the second cooler 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
