| 摘要 |
PURPOSE: A substrate and a semiconductor device package using the substrate are provided to prevent the separation of the substrate and a light emitting device by suppressing the generation of stress due to a thermal expansion coefficient difference between the substrate and the device. CONSTITUTION: A base substrate(102) has conductivity. A first adhesive layer(110) is formed on the upper part of the base substrate. A heat conductive layer(120) is formed on the upper part of the first adhesive layer. A second adhesive layer(130) is formed on the upper part of the heat conductive layer. A solder layer(140) is formed on the upper part of the second adhesive layer.
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