ELECTRONIC DEVICE WITH HEAT-DISSIPATING STRUCTURE

摘要

An electronic device (100) having a heat-dissipating structure is disclosed. The electronic device (100) comprises a circuit board (110) and a heat conduction plate (132; 142) arranged to face the circuit board (110). The electronic device (100) dissipates heat generated by the circuit board (110) only in a direction parallel to the heat conduction plate (132; 142). The electronic device (100) is particular suitable for the application wherein the electronic device (100) will be stacked up on another electronic device and requires no any forced convection arrangement such as a fan.