Method for manufacturing reflective optical element for extreme ultraviolet lithography for manufacturing of semiconductor devices, involves providing substrate, applying releasing layer, and applying layer with optical function

摘要

The method involves providing (110) a substrate, applying (112) a releasing layer, and applying a layer with optical function. The releasing layer is applied such that it has a defined adhesion on the substrate. The releasing layer is formed by a mixture of two materials. The releasing layer is formed by simultaneous application of two materials or by alternately applying thinner layers of the two materials. A hydrogenation, nitrification or oxidation of the material of the releasing layer is executed during application of the releasing layer. An independent claim is included for a reflective optical element for extreme ultraviolet lithography.