发明名称 |
Epitaxy Profile Engineering for FinFETs |
摘要 |
A method of forming an integrated circuit structure includes providing a wafer including a substrate and a semiconductor fin at a major surface of the substrate, and performing a deposition step to epitaxially grow an epitaxy layer on a top surface and sidewalls of the semiconductor fin, wherein the epitaxy layer includes a semiconductor material. An etch step is then performed to remove a portion of the epitaxy layer, with a remaining portion of the epitaxy layer remaining on the top surface and the sidewalls of the semiconductor fin.
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申请公布号 |
US2013001705(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213608961 |
申请日期 |
2012.09.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;SU CHIEN-CHANG;KWOK TSZ-MEI;LIN HSIEN-HSIN;SUNG HSUEH-CHANG;PAI YI-FANG;CHEN KUAN-YU |
发明人 |
SU CHIEN-CHANG;KWOK TSZ-MEI;LIN HSIEN-HSIN;SUNG HSUEH-CHANG;PAI YI-FANG;CHEN KUAN-YU |
分类号 |
H01L29/78 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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